Lea Heusinger-Jonda
14 November 2022

JIACO Instruments at Defense Manufacturing Conference (DMC) 2022, December 5 – 8, Tampa, Florida

Visit JIACO Instruments to discuss artifact-free MIP decapsulation This year, for the first time, JIACO will be exhibiting at Defense Manufacturing Conference, which will be held […]
6 October 2022

JIACO Instruments at ISTFA conference 2022, Oct 30 – Nov 3, Pasadena, California

Visit JIACO Instruments to discuss artifact-free MIP decapsulation Traditionally, we are joining as one of the exhibitors at this year’s edition of International Symposium for Testing […]
22 September 2022

New publication – MIP decapsulation enabling failure analysis of IGBT modules

Work recently published in Microelectronics Reliability 137 (2022), 114766, describes extensive failure analysis process, developed to localize and analyze in details aluminium corrosion in IGBT modules. […]
23 June 2022

JIACO Instruments at IPFA 2022 (July 18 – 20, Singapore)

Visit us in the exhibition hall at the booth B1 The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits […]
23 May 2022

JIACO Instruments joins this year’s edition of CAM-Workshop (June 14 – 15, in Halle, Germany)

Visit us in the exhibition hall at the booth 4 CAM-Workshop brings together experts from the electronics industry and from material diagnostics equipment manufacturers in order […]
19 April 2022

JIACO Instruments at ECTC 2022 (IEEE 72nd Electronic Components and Technology Conference), May 31 – June 3, San Diego, California

Visit us on exhibition days at booth 611 The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in […]
9 February 2022

JIACO Instruments at IMAPS DPC conference 2022, March 7 – 10, Fountain Hills, Arizona

Visit us on exhibition days at booth 36 We are delighted to announce that we will be joining 18th annual Device Packaging Conference (DPC 2022), held in Fountain […]
22 November 2021

EDFA Magazine article on Microwave Induced Plasma (MIP) removal of interposer overmold in 2.5D packages

GlobalFoundries have recently published an article with a title “Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue […]
1 October 2021

JIACO Instruments at ISTFA conference 2021, Oct 31 – Nov 4, Phoenix, Arizona

Visit JIACO Instruments to discuss artifact-free decapsulation Booth 818: See our machine, discuss potential collaboration Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or […]
WordPress › Error

There has been a critical error on this website.

Learn more about troubleshooting WordPress.