𝗙𝗿𝗼𝗺 𝗡𝗼𝘃𝗲𝗺𝗯𝗲𝗿 𝟭𝟲𝘁𝗵–𝟮𝟬𝘁𝗵, our colleagues Jiaqi Tang, Yashan Peng, Ruben Tibben, Sarah Zerouali and Mark McKinnon will be attending ISTFA 2025 in Pasadena, CA, USA!   

ISTFA’s theme, “Scaling Beyond Moore’s Law,” reflects a rapidly evolving industry with increasingly complex semiconductor and packaging technologies. Failure Analysis plays an increasingly critical role in ensuring the reliability of the next generation of microelectronics.  

JIACO Instruments supports the industry’s shift toward complex and miniaturized device architectures, enabling precise, damage-free decapsulation of semiconductor packages and providing clearer insight into root-causes.   

Learn about our latest developments in the Tools of the Trade Tour on Monday night. 

Hear Brandon Capellini explain how MIP solve’s their issues with decapsulation of Gallium Arsenide (GaAs) devices in their paper ‘Efficient Preparation of GaAs Devices utilizing Microwave Induced Plasma Decapsulation’ on Wednesday, November 19th between 3:00 PM-4:00 PM  

Read about Mr Brandon Capellini’s poster session: https://asm.confex.com/asm/istfa25/webprogram/Paper64577.html  

𝗩𝗶𝘀𝗶𝘁 𝘂𝘀 𝗮𝘁 𝗯𝗼𝗼𝘁𝗵 #715 during ISTFA to discuss how we can help ensure the reliability of your products.   

We look forward to meeting with you at ISTFA 2025!