The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. This year marks 75 years of ECTC!

On Thursday May 29th during the Interactive Presentations session 3 (10:00 – 12:00) , JIACO Instruments Ya-Shan Peng will present ‘Accelerating Root Cause Identification of Subtle Bonding Failures With Microwave Induced Plasma’ together with her co-authors from Texas Instruments. This paper demonstrates using JIACO Microwave Induced Plasma (MIP) decapsulation to reveal subtle bonding failures that go undetected in curve trace analysis.

During ECTC’s exhibition on Wednesday & Thursday, you can find JIACO Instruments at booth 513. Make sure to stop by at our booth to find out more about how our atmospheric plasma solutions for decapsulation and die level etching are enabling new solutions to the semiconductor industries pressing reliability & FA challenges, especially with the move to advanced packaging.

Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ECTC).

Read more about ECTC & register online: https://ectc.net/index.cfm